🔥 News

  • 2025.09: 😁 I will chair a special session at EWSHM 2026 alongside Dr. Hanqing Zhang, Prof. Shenghan Zhang, Dr. Alice Cicirello, and Prof. Hae Young Noh. We warmly invite you to join us in Toulouse, France.
    (SS 11: AI-powered structural sensing and health monitoring for civil engineering structures)
  • 2025.08: 🎉 I am honored to serve as a member of the Technical Committee for ICMIE 2025. Welcome to join us in Tai Cang (China).
  • 2025.06: 🎊 Prof Shenghan Zhang presented our recent work UHGAN for bottom-up structure-level damage assessment on ICOSSAR’25.
  • 2025.06: 🎊 I present my recent work DMPN for trustworthy structural damage assessment by fusing heterogeneous data on ICOSSAR’25.
  • 2025.03: 🎉 Physical-Constrained FiberNet on strain distributions interpretation, collaborated with Xuanyi Lu and Shenghan Zhang, has been published in Automation in Construction.
  • 2025.02: 🎉 One work collaborated with Tongji University on steel fatigue cracks detection using geometric computer vision technology has been published in Structural Control and Health Monitoring.
  • 2025.01: 😁 I have been honored with the title of Outstanding Reviewer for IEEE TIM.
  • 2024.12: 🎉 Weakly-aligned Cross-modal Learning Framework for subsurface defect segmentation on building façades has been accepted for publication in Automation in Construction.
  • 2024.09: 📖 I am honored to give a guest lecture again on Machine Learning in Structural Sensing and Health Monitoring.
  • 2024.06: 😁 I will exhibit my work with Prof. Zhang, Dr. Mishra and Prof. Yuen on subsurface defect segmentation in EWSHM 2024.
  • 2024.06: 🎊 I will serve as Associate Editor for IEEE Transactions on Instrumentation and Measurement.
  • 2024.02: 🎉 My paper collaborated with Dr. AO Wai Kei and Prof. NI Yi-Qing has been accepted for publication in IEEE TIM.
  • 2023.09: 📖 I give a guest lecture on Machine Learning in Structural Sensing and Health Monitoring.
  • 2023.09: 🚀 I join the group of Prof. Shenghan ZHANG at The Hong Kong University of Science and Technology.